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Seismic packaging for electronic products

Application areas: Electronics, fragile and industrial instrument packaging.
Customer pain point: Products are easy to be damaged by collision during the transportation due to the fragile feature.
Solution: Absorb the collision energy, capable for bearing deformation, provide steady buffer for products.
Quantitative results:
• Capable for absorbing even 90 percent of energy during the collision .
• Available to produce complex shape liner that completely suitable for the shape of product to be packed

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