Actualités

Seismic packaging for electronic products

Domaines d'application : Electronics, fragile and industrial instrument packaging.
Point de douleur du client: Products are easy to be damaged by collision during the transportation due to the fragile feature.
Solution : Absorb the collision energy, capable for bearing deformation, provide steady buffer for products.
Résultats quantitatifs :
• Capable for absorbing even 90 percent of energy during the collision .
• Available to produce complex shape liner that completely suitable for the shape of product to be packed

Partager cet article :

Table des matières

    Recherche

    POPULAIRES POSTS

    Sustainable Choice: How FSH EPS Foam Meets Fire & Green Building Standards
    Seismic packaging for electronic products
    Food preservation

    Vous avez des questions?

    fr_FRFrench